Heat dissipating apparatus

ABSTRACT

A heat dissipating apparatus includes a base and a heat pipe. A plurality of fins partially overlaps the base; the heat pipe comprising a first body, a second body and a third body, the second body connected between the first body and the third body; the first body is secured between the plurality of fins and the base, the third body is secured to the plurality of fins, and the second body is located in a first corner between the base and the plurality of fins.

REARGROUND

1. Technical Field

The present disclosure relates to heat dissipating apparatuses.

2. Description of Related Art

A heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated by electronic components in the electronic device. Generally, the heat dissipating module comprises a cooler and a fan. The cooler is secured to an electronic component and comprises a plurality of fins. An airflow path is defined between each two adjacent fins, and the fan is located in the path of the airflow, to remove heat from the electronic device. However, with the cooler fixed directly and entirely on the one electronic component, the cooler itself will block airflow to cool the other electronic components behind the cooler, which is inefficient.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an assembled, isometric view of a heat dissipation apparatus and a computer in accordance with one embodiment.

FIG. 2 is an exploded, isometric view of the heat dissipation apparatus and the computer of FIG. 1.

FIG. 3 is an assembled, isometric view of the heat dissipation apparatus of FIG. 1.

FIG. 4 is an exploded, isometric view of FIG. 3.

FIG. 5 is a cross section view of the heat dissipation apparatus of FIG. 3.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

Referring to FIG. 1 and FIG. 2, a heat dissipation apparatus 100 in accordance with an embodiment is secured to a computer 30.

The computer 30 includes a bottom plate 31 and a main board 50. The main board 50 is secured to the bottom plate 31 and defines a plurality of positioning holes 53. An electronic component 51 is secured to the main board 50. In one embodiment, the main board 50 may be a motherboard, and the electronic component 51 may be a CPU.

Referring to FIG. 3 and FIG. 4, the heat dissipating apparatus 100 includes a cooler 10, two heat pipes 19, a fan 20, and a base 40.

The cooler 10 includes a shell 60 and a plurality of fins 16. The shell 60 includes a top plate 13, a first side plate 15, and a second side plate 17. In one embodiment, the top plate 13 is substantially perpendicular to the first side plate 15 and the second side plate 17, and the first side plate 15 is substantially parallel to the second side plate 17. The first side plate 15 defines two openings 151 and a notch 153. The notch 153 extends from a bottom edge of the first side plate 15. A plurality of mounting pieces 18 extends from a side edge of each of the first side plate 15 and the second side plate 17. Each mounting piece 18 defines a mounting hole 181. The fins 16 are received in the shell 60 and enclosed by the top plate 13, the first side plate 15, and the second side plate 17. Each fin 16 defines two receiving holes 161, and the receiving holes 161 correspond to the openings 151. Each fin 16 defines two first receiving slots 163. The two first receiving slots 163 correspond to the notch 153. In one embodiment, the cross-section of each first receiving slot 163 is semicircular.

Each heat pipe 19 includes a first body 191, a second body 193, and a third body 195. In one embodiment, the heat pipes 19 are generally substantially “U” shaped. The second body 193 is connected between the first body 191 and the third body 195. A length of the first body 191 is longer than a distance between the first side plate 15 and the second side plate 17, and a length of the third body 195 is substantially equal to the distance between the first side plate 15 and the second side plate 17. A first angle is defined between the first body 191 and the second body 193. In one embodiment, the first angle is acute. In one embodiment, a cross-section of each heat pipe is round. The cooling fan 20 defines a plurality of through holes 21.

The base 40 defines two second receiving slots 43 and a plurality of locking holes 41. The locking holes 41 correspond to the positioning holes 53. In one embodiment, a cross-section of each second receiving slot 43 is semicircular.

In assembly, the cooler 10 is secured to the base 40, and the first receiving slots 163 are aligned with the second receiving slots 43. The first side plate 15 is secured to the base 40 and located between a first edge of the base 40 and a second edge of the base 40. The second end of the base 40 is substantially parallel to the first edge of the base 40 and located between the second side plate 17 and the first side plate 15. The fins 16 are partially overlapping the base 40. The first body 191 is received in the first receiving slot 163 and the second receiving slot 43 and sandwiched between the base 40 and the fins 16. The third body 195 is inserted through the opening 151 and the receiving holes 161. The second body 193 is located in a corner between the base 40 and the first side plate 15. A second angle is defined between the second body 193 and the third body 195. In one embodiment, the second angle is obtuse. A plurality of locking members (not labeled), such as screws, is inserted into the locking holes 41 and the corresponding positioning holes 53, so that the base 40 is secured to the main board 50 on the electronic component 51.

In use, heat generated by the electronic component 51 is transferred to the first body 191 by the base 40. The first body 191 transfers the heat along a first direction, which is towards the cooler 10, and to the second body 193 along a second direction. The second body 193 transfers the heat to the fins 16 via the third body 195. The cooling fan 20 removes the heat from the cooler 10, and the electronic component 51 is cooled thereby.

It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. 

1. A heat dissipating apparatus comprising: a base; a cooler, secured to the base, comprising a first side plate, a second side plate and a plurality of fins secured between the first side plate and the second side plate; and a heat pipe comprising a first body, a second body and a third body, the first body and the third body are secured to the cooler, and the second body is connected between the first body and the third body; wherein the first side plate is secured to the base and located between a first edge of the base and a second edge of the base, the second end of the base is located between the second side plate and the first side plate, and the second body is located in a corner between the base and the first side plate.
 2. The heat dissipating apparatus of claim 1, wherein a first angle is defined between the first body and the second body, and the first angle is acute.
 3. The heat dissipating apparatus of claim 1, wherein a second angle is defined between the second body and the third body, and the second angle is obtuse.
 4. The heat dissipating apparatus of claim 1, wherein the first side plate and the second side plate are substantially perpendicular to the base.
 5. The heat dissipating apparatus of claim 1, wherein a length of the first body is greater than a distance between the first side plate and the second side plate.
 6. The heat dissipating apparatus of claim 1, wherein the first edge of the base is substantially parallel to the second edge of the base.
 7. The heat dissipating apparatus of claim 1, wherein the first body is substantially parallel to the third body.
 8. The heat dissipating apparatus of claim 1, wherein each of the plurality of fins defines a receiving hole, and the third body is located in the receiving holes of the plurality of fins.
 9. The heat dissipating apparatus of claim 8, wherein the first side plate defines an opening, the opening is aligned with the receiving holes of the plurality of fins, and the first body is engaged in the opening.
 10. The heat dissipating apparatus of claim 1, wherein the base defines a first receiving slot, each of the plurality of fins defines a second receiving slot, and the first body is located in the first receiving slot and the second receiving slot.
 11. A heat dissipating apparatus comprising: a base; a plurality of fins partially overlapping the base; and a heat pipe comprising a first body, a second body and a third body, the second body connected between the first body and the third body; wherein the first body is secured between the plurality of fins and the base, the third body is secured to the plurality of fins, and the second body is located in a first corner between the base and the plurality of fins.
 12. The heat dissipating apparatus of claim 11, wherein a first angle is defined between the first body and the second body, and the first angle is acute.
 13. The heat dissipating apparatus of claim 11, wherein a second angle is defined between the second body and the third body, and the second angle is obtuse.
 14. The heat dissipating apparatus of claim 11, wherein the first body is substantially parallel to the third body.
 15. The heat dissipating apparatus of claim 11, wherein the plurality of fins is located in a shell, and the shell comprises a first side plate and a second side plate, the first side plate is secured to the base and located between a first edge of the base and a second edge of the base, the second end of the base is located between the second side plate and the first side plate, and the second body is located in a second corner between the first side plate and the base.
 16. The heat dissipating apparatus of claim 15, wherein each of the plurality of fins defines a receiving hole, and the third body is located in the receiving holes of the plurality of fins.
 17. The heat dissipating apparatus of claim 16, wherein the first side plate defines an opening, and the opening is aligned with the receiving holes of the plurality of fins, and the first body is engaged in the opening.
 18. The heat dissipating apparatus of claim 15, wherein the first edge of the base is substantially parallel to the second edge of the base.
 19. The heat dissipating apparatus of claim 15, wherein a length of the first body is greater than a distance between the first side plate and the second side plate.
 20. The heat dissipating apparatus of claim 11, wherein the base defines a first receiving slot, each of the plurality of fins defines a second receiving slot, and the first body is located in the first receiving slot and the second receiving slot. 